Product Features: Compatible with JEDEC eMMC5.1 specification and HS400 high-speed mode, good compatibility with mainstream platforms SAMSUNG's latest manufacturing process flash memory and high-performance main control chip are adopted to ensure the smooth operation and stability of the system Full capacity options range from 4GB to 128GB, supporting more scenarios to meet customers' full capacity requirements
Product Features: eMMC and LPDDR multi-chip package scheme is adopted to reduce the system development time and reduce the PCB occupied area The isolation design between eMMC and LPDDR effectively reduces signal interference and stabilizes data transmission rate
Product Features: Covers DDR3(L) and DDR4 products. The product capacity ranges from 2Gb to 8Gb, meeting various capacity requirements Meet the network communication, intelligent terminal data cache requirements
Product Features: 3D NAND FLASH, greatly improve the capacity density, capacity up to 256GB Built-in functional modules significantly improve sequential read and write speed, which shortens task processing time and significantly reduces power consumption Extreme speed experience, suitable for mobile intelligent terminal products
Since its establishment, the company has always been adhering to the business philosophy of "credibility-based, quality first, and customer first". High-quality sales and service team, and has developed a marketing system centered on Shenzhen and radiating all over the world. Provide economical, fast and convenient supporting services for customers in various regions.
